We represent established and emerging companies in all phases of the semiconductor industry including processing, packaging, fabrication and test equipment. In particular, our practitioners are experienced in the areas of wire bond and BGA packaging, plasma etch, cleaning and deposition, photolithography equipment, mask/etch and damascene processing and optical test equipment, among others.
National Semiconductor, LSI Logic, Lam Research, KLA-Tencor, Nikon Research Corp.
|LSI Logic||5,926,720||Consistent Alignment Mark Profiles on Semiconductor Wafers Using PVD Shadowing|
|LSI Logic||5,994,211||Method and Composition for Reducing Gate Oxide Damage During RF Sputter Clean|
|National Semiconductor||5,789,809||Thermally Enhanced Micro-Ball Grid Array Package|
|Lam Research Corporation||5,933,314||Method and Apparatus for Offsetting Plasma Bias Voltage in Bipolar Electro-Static Chucks|
|National Semiconductor Corp||6,664,615||Method and Apparatus for Leadframe Based Grid Array IC Packaging|
|National Semiconductor Corp||7,095,116||Aluminum-Free Under Bump Metallization Structure|
|National Semiconductor Corp||7,230,580||Design of a Two Interconnect IC Chip for a Radio Frequency Identification Tag and Method for Manufacturing Same|
|National Semiconductor Corp||7,247,209||Dual Outlet Nozzle for the Combined Edge Bead Removal and Backside Wash of Spin Coated Wafers|