James W. Rose
Mr. Rose's practice is directed to patent prosecution, strategic patent portfolio development, and developing patents that can be enforced, licensed and/or litigated. Mr. Rose also specializes in counseling clients with regard to in-house matters, such as identifying key inventions and technologies, internal review of patent disclosures, and increasing the value of portfolios by filing patent applications, including continuation applications, covering the product and/services offered by clients and anticipating the same by competitors.
Mr. Rose has technical expertise in a wide range of technologies, including circuitry, computing systems including microprocessors, networking technologies, telecommunications, medical technologies, software applications, mobile "apps", semiconductor fabrication, and semiconductor fabrication equipment.
Prior to joining Beyer Law group, Mr. Rose worked in-house in both start-up companies and large corporations, as the VP of Intellectual Property at Wrap Media, Chief Patent Counsel at Voxer and Altera Corporation, and patent counsel at Sun Microsystems and National Semiconductor.
Mr. Rose is a registered U.S. patent attorney and a member of the State Bar of California since 1989. He also has a BSEE degree from Villanova University and a JD degree from the University of New Hampshire (formally Franklin Pierce Law Center).
- B.S. in Electrical Engineering from Villanova University
- JD degree from the University of New Hampshire (formally Franklin Pierce Law Center)
Patents Mr. Rose has worked on:
US Patent 9,600,594 Wrap Media, LLC
Card Based Package for Delivering Electronic Media and Services
US Patent 9,600,803 Wrap Media, LLC
Mobile-first Authoring for Authoring of Wrap Packages
US Patent 9,634,969 Voxer IP LLC
Real-time Messaging Method and Apparatus
US Patent 9,621,491 Voxer IP LLC
Telecommunication and Multimedia management Method and Apparatus
US Patent 7,545,479 Voxer IP LLC
Apparatus and Method for Maintaining Immersion Fluid in a Gap Under the Projection Lens During Wafer Exchanges